Indira Gandhi Centre For Atomic Research Tender
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Indira Gandhi Centre For Atomic Research - IGCAR Tender
Housekeeping Services
Eprocure
Opening Date5 Aug 2024
Closing Date19 Aug 2024
Tender Amount₹ 21,89,815
Costs
EMD
₹ 43,796Document Cost
Refer DocumentsTender Fee
Refer Documents
Description
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Contact
Tender Id
2024_IGCAR_819605_1Bid Award Id
ViewTender No
IGC/DDSD/ARDSS/KS/MP/1/2024Tender Authority
Indira Gandhi Centre For Atomic Research ViewPurchaser Address
-Website
http://eprocure.gov.in
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Documents
BOQ Items
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Operation of the 400 kV accelerator for low dose implantations. Startup of the ion source and other subsystems of the accelerator, applying the terminal voltage, tuning the parameters to get the desired beam current at the target to carry out the ion implantation. Shutting down of the accelerator as per the procedure.
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Operation of the 150 kV accelerator. Startup of the ion source and other subsystems of the accelerator, applying the terminal voltage, tuning the parameters to get the desired beam current at the target to carry out the ion implantation. Shutting down of the accelerator as per the procedure.
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Fixing of new flanges and modifying the ports for new attachments in the vacuum systems for Magnetron sputtering, PLD and SIMS systems. It involves fitting High Vacuum and Ultra High Vacuum flanges with Teflon and Copper gaskets.
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Gas cylinder movement which includes empty High pure and Ultra high pure gas cylinders used in accelerators, sputtering, PLD and SIMS facilities should be removed from gas storage/usage areas. Loading/ Unloading of the cylinders in Battery truck from stores and Lab, refilling of the gas cylinders, bringing back the filled cylinders from stores, Storing the cylinder in their respective place and chaining the cylinder with wall as per safety norms. Minimum of 4 cylinders at a time.
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Leak testing of vacuum systems.To test the vacuum leak, soap solution technique and He leak test should be performed in the High Vacuum and Ultra High Vacuum systems on weekly basis to upkeep of the vacuum systems.
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Substrate preparation for thin film deposition. Samples are cut and fixed in polishing moulds after cleaning by organic solvents and emery sheets. These samples are polished starting from 400 to 4000 grit emery sheets and thereafter by 4, 2 micron diamond lapping compound. The roughness in the samples as measured by surface profilometry should be less than 50 nm.
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Making and monitoring of Gas line connections, high pressure joints which includes logging mass flow controller data of gases, recording and plotting the gas flow data, pressure data. HPGe detector data monitoring which shall include Vacuum, current and voltage monitoring and plotting.
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Chemical Cleaning of glass wares. Chemical cleaning of glass wares, SS vacuum components and furnace tubes.
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Maintenance and servicing of the vacuum pumps. This work include regular checking of the oil levels in rotary pump, filling of the oils, replacement of O rings or other parts under the supervision of department personnel. Servicing work of vacuum pump include dismantling of pumps from beam line, dust removal and cleaning of cooling fan, checking and emery cleaning of electrical connections inside the motor, draining of rotary oil, cleaning of oil level view port, rinsing the pump with fresh oil & draining the oil after few minutes of running, Filling of fresh rotary oil up to the level indicator, Changing of “o” ring and gasket if required in the sealing area, Running & Vacuum testing of rotary pump with Pirani/ Thermocouple gauge to attain 1x10-3 mbar at blank–off condition, Cleaning of metal bellow with soap solution, Rinsing with ordinary water for 15min, Drying with Hot air blower for 15min to remove the water particle from the bellow completely, Assembly of bellow and rotary pump with TMP in the beam line.
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Sample preparation for step height measurement studies of irradiated samples. Samples are to be fixed in polishing moulds after prior cleaning by emery and organic solvent – The samples are to be polished starting from 400 grit to 4000 grit and thereafter by 4 microns, 2 microns diamond lapping compound. The roughness in the samples as measured by surface profilometry should yield lesser than 10 nm.
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Sample preparation for ion implantation of micrometer thick samples. 10x10mm x0.5mm thick steel samples are to be thinned by mechanical polishing to a thickness of 100micrometer and subsequently electro polished on both sides. After the irradiation experiments 3mm dia discs are to be punched out from the 10mm x 10mm samples.
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Sample preparation for ion implantation of thick samples. 10x10mm x 1mm thick steel, aluminium samples are to be polished with emery with varying grit sizes, followed by diamond polishing. Mirror finishing to be achieved one or both sides.
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Sample mounting for high temperature irradiation studies. Samples are to be mounted on tantalum mounts and knife edges are to be spot welded onto tantalum frames and firmly fixed on the samples. Contacts for thermocouples and current integration are to be provided on the tantalum mounts. The entire assembly has to be precision mounted onto a XYZ, rotation sample manipulator. Quartz beam monitors are to be fixed for beam positioning. Further heating tests and tests for monitoring leakage currents are to be conducted and the whole assembly is to be mounted on a vacuum chamber and alignment of the sample with the beam entry port of the chamber is to be carried out.
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Assembling of heater/heater stage. The UHV heater stage comprises of a 0.25 mm tungsten wire enclosed in 0.3 mm thin walled alumina tubes. This is enclosed in a molybdenum casing comprising of sapphire balls, radiation shield and electrical contacts. The heater wire replacement procedure is a delicate and laborious procedure involving disassembly of several tiny components winding of heater in tiny alumina cylinders and reassembling.
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Maintenance of deionised water levels in three chillers which include transporting and filling of 1000 litres DM in chillers.
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Dismantling, cleaning and reassembling of the ion sources in 1.7 MV accelerator, 400 kV accelerator and 150 kV accelerator as per the standard procedures. Miscellaneous works
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Miscellaneous material handling and transport works which includes transport of liquid nitrogen from MSG liquid nitrogen plant to accelerator lab in lots of 50 liters and filling of liquid nitrogen in SiLi detectors and other systems at MSG and UGC. Filling of liquid nitrogen in 2 anti-contaminator devices in the beamlines(30 litres per week). Movement/changing of gas cylinders for experimental systems, rapid thermal annealing, venting systems, etc.
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Monitoring and data logging of i) Various parameters of 4 chillers, 3 air compressors, centralized and package ac systems, etc ii) Temperature, vibration, noise level, current of all vacuum pumps, Temperature and humidity of all the three accelerator halls and control room iii) SF6 and Oxygen level in accelerator halls iv) sound, light, back ground radiation
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Periodic maintenance of one pallet truck which includes dismantling of Tow bar, Release valve, Tow bar return spring and Hydraulic pump unit, cleaning of individual parts with kerosene, checking of oil seal in the pump unit, oil seal change, lubrication and greasing of all the joints and wheels, reassembling of unit, load testing and trial run.
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Periodic maintenance of 3 nos of air compressors which includes checking and replacing air fuel management components, lubricant maintenance, draining water from the tank and replacing seals. Also Included are : checking for oil and air leaks, checking the differential pressure in the compressed air filter, oil change, verifying safe operating temperature, draining condensation from air receiver tanks and generating status logs
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Servicing of various gadgets such power supply units, sample holders, helium quenching devices, controller, fibre optic duplex and simplex transmitters/receiver boards etc. under the supervision of department staff
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Day to day operation of various electronic and videoconferencing systems of MSG meeting rooms, seminar halls
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Soldering and wiring of the circuit in prototype Printed Circuit boards, Testing of the circuit and preparation of the detailed report.
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Preparation of the schematic drawing and design of the single and double sided PCBs using orcad/cadstar design softwares.
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Electronic instrument box fabrication including design of front and back panels, fittings of PCBs and panel components, interconnecting and wiring and testing them.
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Overall rebate (Optional)
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