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Indian Air Force

Pakur, Jharkhand

  • Opening Date

    03 Sep 2019

  • Closing Date

    10 Sep 2019

  • Tender Amount

    Refer document

  • EMD

    -

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Summary

Rocurement Of Microprocessor Device For 7.5 Ton Package Airconditioner Plant

Documents
PROCUREMENT OF MICROPROCESSOR DEVICE FOR 7.5 TON PACKAGE AIRCONDITIONER PLANT
PROCUREMENT OF MICROPROCESSOR DEVICE FOR 7.5 TON PACKAGE AIRCONDITIONER PLANT
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Tender No: 507SU/456/1/Lgs (PC-69/19-20) dated 03 Sep 19 1 (Aakash Dara) Squadron Leader Bidder’s Sign & Stamp Senior Logistics Officer Air Force Station, Singarsi GOVERNMENT OF INDIA INDIAN AIR FORCE 507 SU: AIR FORCE STATION SINGARSI DIST- PAKUR, JHARKHAND-814111 INVITATION OF BIDS ONLINE FOR PROCUREMENT OF MICROPROCESSOR DEVICE FOR 7.5 TON PACKAGE AIRCONDITIONER PLANT UNDER TWO BID SYSTEM The tender reference number is 507SU/456/1/Lgs (PC-69/19-20) Dated 03 Sep 19 and can be viewed at www.defprocure.gov.in. 1. Bids are invited online following Two bid system for supply of items listed in Part II of this RFP. The documents to be submitted offline (N/A) should be super scribed with above mentioned Title, RFP number and date of opening of the Bids on the sealed cover 2. The envelope submitted offline should contain the original EMD/EMD exemption certificate.(N/A) 3. The address and contact numbers for sending doc is given below (seek clarification feature available on site to be utilized. No offline clarification regarding contents of RFP will be entertained) – (a) Doc to be addressed to : Station Commander Air Force Station, Singarsi PO- Dumerchir, Dist- Pakur -814111 Jharkhand (N/A) (b) Postal address for sending the Bids : As per para 3 (a) above (c) Name/designation of the contact personnel : Aakash Dara Squadron Leader Senior Logistics Officer Air Force Station, Singarsi PO- Dumerchir, Dist- Pakur -814111 Jharkhand (d) Telephone numbers of the contact personnel: 06423-242388/9608263576 (e) Fax number : 06423-242388 (f) E-mail ID (s) of contact personnel : alpha_sing@iaf.nic.in Tender No: 507SU/456/1/Lgs (PC-69/19-20) dated 03 Sep 19 2 (Aakash Dara) Squadron Leader Bidder’s Sign & Stamp Senior Logistics Officer Air Force Station, Singarsi 4. This RFP is divided into five parts as follows: (a) Part I – Contains General Information and Instructions for the Bidders about the RFP such as the time, date of submission and opening of tenders, Validity period of tenders, etc. (b) Part II – Contains essential details of the items/services required, such as the Schedule of Requirements (SOR), Technical Specifications, Delivery Period, Mode of Delivery and Consignee details. (c) Part III – Contains Standard Conditions of RFP, which will form part of the Contract with the successful Bidder. (d) Part IV – Contains Special Conditions applicable to this RFP and which will also form part of the contract with the successful Bidder. (e) Part V – Contains Evaluation Criteria and Format for Price Bids. 4. This RFP is being issued with no financial commitment and the buyer reserves the right to change or vary any part thereof at any stage. Buyer also reserves the right to withdraw the RFP, should it become necessary at any stage. Yours faithfully, (Aakash Dara) Squadron Leader Senior Logistics Officer Air Force Station, Singarsi For and on behalf of The President of India Office Stamp Date: Sep 19 Tender No: 507SU/456/1/Lgs (PC-69/19-20) dated 03 Sep 19 3 (Aakash Dara) Squadron Leader Bidder’s Sign & Stamp Senior Logistics Officer Air Force Station, Singarsi Part I – General Information 1. Critical Dates. The critical dates with respect to the RFP NO: 507SU/456/1/LGS (PC-69/19-20) 2. Manner of depositing the Bids. Commercial bid needs to be uploaded in Def Proc Site by due date and time after due digital signature of the vendor. RFP copy available online is to be signed on each page, (PART 2 PARA 3 of RFP TO BE FILLED UP FOR COMPLIANCE/DEVIATION IF ANY) and uploaded as part of tech bid. The envelope containing original EMD needs to be sent by registered post/hand at the address given above or deposited in the tender box marked “PROCUREMENT OF MICROPROCESSOR DE

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