University Of Strathclyde Tender
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University Of Strathclyde Tender
Opening Date23 Aug 2023
Closing Date23 Aug 2024
Tender AmountRefer Documents
Costs
Summary
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Description
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Contact
Tender Id
AUG486653Tender No
AUG486653Tender Authority
University Of Strathclyde ViewPurchaser Address
-Website
https://www.strath.ac.uk/
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