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Tenders of University Of Strathclyde

Tenders of University Of Strathclyde

University Of Strathclyde Tender

United Kingdom
Consultant For Digital Dairy Chain In Cumbria
Closing Date13 Nov 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

United Kingdom
Consultant For Digital Dairy Chain In Cumbria
Closing Date13 Nov 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

Software and IT Solutions
United Kingdom
Provision Of A Global Outbound Payment Solution Inclusive Of The Design, Testing, Hosting And Management Of Services
Closing Date11 Nov 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

Machinery and Tools
United Kingdom
Supply, Delivery And Installation Of Wafer Dicing Kit For Nmis
Closing Date22 Jul 2024
Tender AmountGBP 1 Million (USD 1.2 Million)

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Closing Date23 Aug 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Closing Date23 Aug 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Closing Date23 Aug 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Closing Date23 Aug 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

United Kingdom
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Closing Date24 Aug 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

United Kingdom
Supply, Delivery And Installation Of Collaborative Robots For Cmac
Closing Date26 Aug 2024
Tender AmountRefer Documents 
41-50 of 204 archived Tenders
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