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University Of Strathclyde
Tenders of University Of Strathclyde

Tenders of University Of Strathclyde

University Of Strathclyde Tender

Machinery and Tools
United Kingdom
Supply, Delivery, Installation & Commissioning Of Mechanical Testing
Closing Date2 Dec 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

Machinery and Tools
United Kingdom
The Supply, Delivery, Installation And Commissioning Of A Cryogenic Mechanical Tester
Closing Date12 Dec 2024
Tender AmountGBP 220 K (USD 280.5 K)

University Of Strathclyde Tender

Civil And Construction...+1Building Construction
United Kingdom
Project For Mep / Infrastructure Improvement Works At The John Anderson Building (2025)
Closing Date13 Dec 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

United Kingdom
Provision Of Architect For The Charles Huang Advanced Technology & Innovation Centre (ch-atic) (riba Stages 0-7)
Closing Date23 Dec 2024
Tender AmountGBP 549 K (USD 685.7 K)

University Of Strathclyde Tender

United Kingdom
Provision Of Architect For The Charles Huang Advanced Technology & Innovation Centre (ch-atic) (riba Stages 0-7)
Closing Date23 Dec 2024
Tender AmountGBP 549 K (USD 685.7 K)

University Of Strathclyde Tender

Machinery and Tools
United Kingdom
Supply, Delivery And Installation Of Wafer Dicing Kit For Nmis
Closing Date22 Jul 2024
Tender AmountGBP 1 Million (USD 1.2 Million)

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Closing Date23 Aug 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Closing Date23 Aug 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Closing Date23 Aug 2024
Tender AmountRefer Documents 

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
Closing Date23 Aug 2024
Tender AmountRefer Documents 
51-60 of 256 archived Tenders
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