Tenders of University Of Strathclyde

Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.

The University Of Strathclyde (the “university”) Is Seeking To Establish A Framework Agreement To Support The Delivery Of Minor Works For Activities Which Fall Under The Lots Below: Lot 1 – Works Value Gbp 0 - 750,000 Lot 2 - Works Value Gbp 750,000 - 4,000,000 Cpv: 45000000, 45200000, 45000000, 45210000, 45200000, 45000000, 45210000.

The Provision Of Pr Services For National Manufacturing Institute Scotland (nmis)

Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.

Supply, Delivery And Commissioning Of A 5 Stage Mixed- Suspension, Mixed-product Removal (msmpr) System

Supply, Delivery, Installation & Commissioning Of A Dedicated 3d Measurement, Inspection & Metrology System

Project For The Design & Construction Of The Charles Huang Advanced Technology & Innovation Centre (ch-atic)

Supply, Delivery, Installation And Commissioning Of A Parallel Peptide Synthesiser

Supply, Delivery, Installation And Commissioning Of A Parallel Peptide Synthesiser

Supply, Delivery And Installation Of Wafer Dicing Kit For Nmis