IHP GmbH Leibniz Institut F R Innovative Mikroelektronik Tender
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IHP GmbH Leibniz Institut F R Innovative Mikroelektronik Tender
Opening Date23 Aug 2024
Closing Date13 Sep 2024
Tender AmountRefer Documents
Costs
Summary
Translated
Support and development of the project proposal "german Chips Competence Center (g3c)"
Original
Unterstützung Und Entwicklung Des Projektantrages "german Chips Competence Center (g3c)"
Description
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Contact
Tender Id
CXSTYYDY18GYGMHXTender No
CXSTYYDY18GYGMHXTender Authority
IHP GmbH Leibniz Institut F R Innovative Mikroelektronik ViewPurchaser Address
-Website
https://www.ihp-microelectronics.com/
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Documents
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