University Of St Andrews Tender Result

Wafer Dicing Saw-Further guidance and support on how to register with InTend can be found at: https://www.st-andrews.ac.uk/media/procurement/supplier-registration-portal.pdf (SC Ref:733701) Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.