Polytechnic Institute of Grenoble Tender Result
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AOC Description
Translated
Chip deferral equipment on substrate with the so-called classic DIE-ATTACH method or according to FLIP-CHIP technology using various welding or collage processes.
Original
Equipement de report de puce sur substrat avec la méthode dite de DIE-ATTACH classique ou selon la technologie FLIP-CHIP en utilisant divers procédés de soudage ou collage.
Contact
Award Id
122274-2014Award No
122274-2014Tender Id
122274-2014Tender Authority
Polytechnic Institute of Grenoble ViewPurchaser Address
-Website
http://http://www.grenoble-inp.fr
AOC Documents
Bidder Details
- Bidder NameThis Information is for unsubscribed user This Information is for unsubscribed user
- Bidder AddressThis Information is for unsubscribed user
- Award Amount234234234200
- Bidder NameThis Information is for unsubscribed user This Information is for unsubscribed user
- Bidder AddressThis Information is for unsubscribed user
- Award Amount234234234200
- Qualified BiddersThis is message for unregistered
- Lowest Bidder662
- Number of Bids99