Polytechnic Institute of Grenoble Tender Result
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Polytechnic Institute of Grenoble Tender Result
Contract Date10 Apr 2014
Contract PeriodNot specified
Contract AmountEUR 1,84,175 (USD 1,91,290.03)
AOC Description
Translated
Chip deferral equipment on substrate with the so-called classic DIE-ATTACH method or according to FLIP-CHIP technology using various welding or collage processes.
Original
Equipement de report de puce sur substrat avec la méthode dite de DIE-ATTACH classique ou selon la technologie FLIP-CHIP en utilisant divers procédés de soudage ou collage.
Contact
Award Id
122274-2014Award No
122274-2014Tender Id
122274-2014Tender Authority
Polytechnic Institute of Grenoble ViewPurchaser Address
-Website
http://www.grenoble-inp.fr
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Bidder Details
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- Award Amount234234234200
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- Lowest Bidder662
- Number of Bids99