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University Of Strathclyde
Tenders of University Of Strathclyde

Tenders of University Of Strathclyde

University Of Strathclyde Tender

Software and IT Solutions
United Kingdom
Closing Date28 Nov 2024
Tender AmountRefer Documents 
Provision Of Scheduling And Workflow Software For Cmac Data Lab

University Of Strathclyde Tender

Civil And Construction...+1Building Construction
United Kingdom
Closing Date13 Dec 2024
Tender AmountRefer Documents 
Project For Mep / Infrastructure Improvement Works At The John Anderson Building (2025)

University Of Strathclyde Tender

Machinery and Tools
United Kingdom
Closing Date12 Dec 2024
Tender AmountGBP 220 K (USD 280.5 K)
The Supply, Delivery, Installation And Commissioning Of A Cryogenic Mechanical Tester

University Of Strathclyde Tender

United Kingdom
Closing Date23 Dec 2024
Tender AmountGBP 549 K (USD 685.7 K)
Provision Of Architect For The Charles Huang Advanced Technology & Innovation Centre (ch-atic) (riba Stages 0-7)

University Of Strathclyde Tender

United Kingdom
Closing Date23 Dec 2024
Tender AmountGBP 549 K (USD 685.7 K)
Provision Of Architect For The Charles Huang Advanced Technology & Innovation Centre (ch-atic) (riba Stages 0-7)

University Of Strathclyde Tender

Plastic and Rubber...+1Chemical Products
United Kingdom
Closing Date8 Sep 2024
Tender AmountRefer Documents 
Laser Sealing

University Of Strathclyde Tender

United Kingdom
Closing Date26 Aug 2024
Tender AmountRefer Documents 
Supply, Delivery, Installation And Commissioning Of One (1) Hot Melt Extruder System For Cmac

University Of Strathclyde Tender

United Kingdom
Closing Date26 Aug 2024
Tender AmountRefer Documents 
Supply, Delivery And Installation Of Collaborative Robots For Cmac

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Closing Date23 Aug 2024
Tender AmountRefer Documents 
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Closing Date23 Aug 2024
Tender AmountRefer Documents 
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
51-60 of 256 archived Tenders
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