Imec EU Pilot Line NV Tender

Title: Pvd For Mram description: A 300mm Wafer Compatible, Multi-chamber Pvd Platform Designed For High Throughput Of Magnetic Tunnel Junctions. Additionally, The Following Pvd And Process Chamber Designs That Must Be Supported Are: 1) Multi-cathode Pvd Chamber 2) A Pre-clean Chamber To Remove Native Oxides And Other Contaminants, 3) Degass/annealing Capability And, 4) A Cryogenic Stage (<100k) Option In, Or Ex, Situ Of The Pvd Modules. Furthermore, The Platform Must Be Compatible With Front Opening Universal Pods With A 25-slot Capacity, Including An Equipment Front End Module And Load-lock System For Wafer Loading. Finally, The Deposition Must Be Computer Controlled And Automated Following Defined Recipes. As An Optional, The Platform Should Be Compatible With Automatic Recipe Upload From Fab Management Software Via A Standardized Protocol, For Example Secs/gem.