Tenders of Ihp Gmbh Leibniz Institut F R Innovative Mikroelektronik
Tenders of Ihp Gmbh Leibniz Institut F R Innovative Mikroelektronik
IHP GmbH Leibniz Institut F R Innovative Mikroelektronik Tender
Electronics Equipment...+1Electrical and Electronics
Germany
The scope of delivery consists of: - 4 RFSOC modules with mounted heat sink and fan - 4 carrier circuit boards - Schematic of the modules and the carrier circuit board in PDF and in Orcad Capture or Altium format - Layout data of the modules and the carrier circuit board in Allegro PCB Designer or Altium format - Documentation for using/programming the clock generation via the firmware on the PS, drivers if necessary
Closing Date20 Nov 2024
Tender AmountRefer Documents
IHP GmbH Leibniz Institut F R Innovative Mikroelektronik Tender
Machinery and Tools
Germany
Delivery of polishing pads for use in the Amat Mirra Mesa Cmp 40 pcs. - Polishing pads X Ic1010tm Window A2 Pad Fh2 20" Acao;4y03 or equivalent 10 pcs. - Polishing pads Ic1000tm Window A2 Pad Dd1 20" Acao;4y14 or equivalent
Closing Date5 Jun 2024
Tender AmountRefer Documents
121-130 of 140 archived Tenders