Chalmers Tekniska Hogskola Tender
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Costs
EMD
NA
Summary
Flipchip Bonder For Assembly Of Semiconductor Components
Description
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Contact
Tender Id
aid85ace1ec5e857532b60d273057b06967Tender No
C 2024-0272Tender Authority
Chalmers Tekniska Hogskola ViewPurchaser Address
-Website
http://https://www.chalmers.se/