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University Of Strathclyde
Tenders of University Of Strathclyde

Tenders of University Of Strathclyde

University Of Strathclyde Tender

Software and IT Solutions
United Kingdom
Closing Date6 May 2024
Tender AmountRefer Documents 
Provision Of E-payment Platform Inclusive Of Design, Testing, Hosting & Management Including Fraud And Debt Management Solution

University Of Strathclyde Tender

Machinery and Tools
United Kingdom
Closing Date26 Apr 2024
Tender AmountRefer Documents 
The University Is Looking To Appoint A Supplier For A New Cafe In The National Manufacturing Institute's (nmis) Headquarters. Cpv: 55330000, 55330000, 55520000.

University Of Strathclyde Tender

Machinery and Tools
United Kingdom
Closing Date22 Jul 2024
Tender AmountGBP 1 Million (USD 1.2 Million)
Supply, Delivery And Installation Of Wafer Dicing Kit For Nmis

University Of Strathclyde Tender

Machinery and Tools
United Kingdom
Closing Date22 Jul 2024
Tender AmountGBP 1 Million (USD 1.2 Million)
Supply, Delivery And Installation Of Wafer Dicing Kit For Nmis

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Closing Date22 Jul 2024
Tender AmountGBP 1 Million (USD 1.2 Million)
Supply, Delivery And Installation Of Wafer Dicing Kit For Nmis

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Closing Date24 Aug 2024
Tender AmountRefer Documents 
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Closing Date23 Aug 2024
Tender AmountRefer Documents 
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Closing Date23 Aug 2024
Tender AmountRefer Documents 
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.

University Of Strathclyde Tender

United Kingdom
Closing Date23 Aug 2024
Tender AmountRefer Documents 
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.

University Of Strathclyde Tender

United Kingdom
Closing Date19 Aug 2024
Tender AmountRefer Documents 
The Supply, Delivery, Installation And Commissioning Of An Optical Microscope
221-230 of 256 archived Tenders
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