Tenders of Hindustan Aeronautics Limited

Tenders of Hindustan Aeronautics Limited

Hindustan Aeronautics Limited - HAL Tender

Works
GEM
India
Closing Date8 Feb 2024
Tender AmountRefer Documents 
CATEGORY: Digital Microscope for PCB Inspection and Rework (Q3)

Hindustan Aeronautics Limited - HAL Tender

India
Closing Date15 Mar 2024
Tender AmountRefer Documents 
2,92,81,000.00

Hindustan Aeronautics Limited - HAL Tender

Goods
Aerospace and Defence
GEM
India
Closing Date15 Mar 2024
Tender AmountRefer Documents 
CATEGORY: SUPPLY, TESTING, COMPONENT PROVE OUT AND TRAINING ON LASER TRACKER (Q3)

Hindustan Aeronautics Limited - HAL Tender

Goods
GEM
India
Closing Date15 Mar 2024
Tender AmountRefer Documents 
CATEGORY: SEALING COMPOUND PR 2050B (Q3)

Hindustan Aeronautics Limited - HAL Tender

Goods
Electronics Equipment...+1Electrical and Electronics
GEM
India
Closing Date15 Mar 2024
Tender AmountRefer Documents 
CATEGORY: SUPPLY OF HEADSET WITH BOOM MICROPHONE (Q3)

Hindustan Aeronautics Limited - HAL Tender

Goods
Publishing and Printing
GEM
India
Closing Date16 Mar 2024
Tender AmountRefer Documents 
CATEGORY: Sleeve Hot Stamping Machine (Q3)

Hindustan Aeronautics Limited - HAL Tender

Goods
Electronics Equipment...+1Electrical and Electronics
GEM
India
Closing Date16 Mar 2024
Tender AmountRefer Documents 
CATEGORY: Programmable regulated DC power supply (Q3) , Temperature Transducer with remote display (Q3) , Precision digital pressure indicator (Q3) , Precision digital pressure indicator_ 0-100psi (Q3)

Hindustan Aeronautics Limited - HAL Tender

Goods
GEM
India
Closing Date16 Mar 2024
Tender AmountRefer Documents 
CATEGORY: 3300447020 (Q3)

Hindustan Aeronautics Limited - HAL Tender

Goods
GEM
India
Closing Date16 Mar 2024
Tender AmountRefer Documents 
CATEGORY: CIRCULAR BROACH (Q3)

Hindustan Aeronautics Limited - HAL Tender

GEM
India
Closing Date16 Mar 2024
Tender AmountRefer Documents 
CATEGORY: P/N. HAL2034140075-28, Dis. RTV 3140 CLEAR (DOW CORNING) , Pack Size: 1 PACK OF 90 GMS (Q3) , P/N. HAL2034140082-07, Dis. SILICON RUBBER SEALANT RTV 3145, CLEAR/GREY Pack Size: 1 PACK OF 90 GMS (Q3) , P/N. 191660651, Dis. P. THERMAL CONDUCTRICE OXIME RTV, TCOR75SSERINGUE75ML, ELECTROLUBE. P/S: 1Pack of90GMS (Q3) , P/N. 191660651, Dis. PASTE THERMAL CONDUCTRICE OXIME RTV, TCOR75S SERINGUE75ML, ELECTROLUBE. P/S: 1P. OF75ML (Q3) , P/N. 185001971, Dis. SILICONE RTV INCOLORE EQ: 15120430-6, TSE-392-C TUBE 100G, 3M. P. Si: 1PACK OF100ML (Q3) , P/N. 185001971, Dis. SILICONE RTV INCOLORE EQ: 15120430-6, TSE-392-C TUBE 100G, 3M. Pac. Si: 1PACK OF100ML (Q3) , P/N. 1178- 0106-10, Dis. SILI, RUB. KIT, SILASTICJRTVKIT, 2PARTS-KIT* BASE-COLO. BEI. , CUR. A-G, P. S1KITOF1100GMS (Q3) , P/N. 1178-0106-10, Dis. SILI. , RUB. KIT, SILASTIC JRTV KIT, 2P. - KIT* BASE-COLOUR B. CU. A-G, P. S: 1KITOF1100GMS (Q3) , P/N. 1183-0101-00, Di. SI. AD. /S. , ELE72- 00002CON/RTVAG1PA. P. E. S: SD1183-0101-00TE. P/N: CO/RT, PS: 1TU56.7GMS (Q3) , P/N. 1183-0101-00, D. S. A/SE72-00002C/RAG1PPES: SD1183-0101-00T. P/N: C/R= I72-00002RSAS1TUB56.7GMS (Q3) , P/N. 1183-0162-00, Di. ADHESIVE, SILICONE ADHESIVE/SEALANT ELE72- 000035CON--/RTV NICKELP/S: 1KITOF454GMS (Q3) , 162-00. SEALANT ELE 72-000035 CON-/RTV NICKEL. P/S. 1 KIT OF 454 GMS. or Chobond 1075, P/S: 2.5OZ / kit (Q3) , P/N. HAL2032390040-08, Dis. ADHESIVE EPOXY, TRA-BOND-BB- 2112, Pack Size: 1 PACK OF 7.8 GMS (Q3) , P/N. CHO-BOND- 50-02-1030-0000, Dis. CHOBOND ADHESIVE1030, FOR O- RING WITH PRIMER1086 P/S: 1KIT OF113.4ML (Q3) , P/N. CHO-BOND-50-02-1030-0000, DisCHOBOND ADHESIVE1030, FOR O-RING WITH PRIMER1086 P/S: 1KIT OF113.4ML (Q3) , P/N. 15122013-6, Dis. GLUE CYANOLITE TYPE 201, Pack Size: 1 PACK OF 2 GMS (Q3) , P/N. 15120258-4, Dis. GLUE ECCOBOND 104 (A+ B) , EMERSON & CUMING OR HENKAL Pack Size: 1 KIT OF 500 GMS (Q3) , P/N. 1754-631, Dis. TENSOL CEMENT NO. 70, ICI. , Pack Size: 1 PACK OF 225 ML (Q3) , P/N. 15120230-2, Dis. E-Solder 3021 Glue, A+ B (SILVER-CONDUCTIVE-ADHESIVE) P/Siz: 1 KIT OF 2.2566 KG (Q3) , P/N. 15120230-2, Dis. E-Solder 3021 Glue, A+ B (SILVER-CONDUCTIVE-ADHESIVE) Pack Size: 1KIT OF2.2566KG (Q3) , P/N. HAL2908090000-16, Dis. Solder Paste, NCSMQ92H Pack Size: 1 PKT OF 500 GMS (Q3) , P/N. HAL2908090015-68, Dis. SOLDER FLUX GEL NO CLEAN, Pack Size: 1 PACK OF 10 GMS (Q3) , P/N. HAL2032040010-82, Dis. ADHESIVE BOSTIK 1782, Pack Size: 1 PACK OF 1000 GMS (Q3) , P/N. 01752-00297, Dis. PRIMER, SILCOSET 105 WITH CURING AGENT A Pack Size: 1 KIT OF 1010 GMS (Q3) , P/N. HAL2305810010-34, Dis. PRIMER FOR SILICON RUBBER, CLEAR, DC Pack Size: 1 PACK OF 500 ML (Q3) , P/N. 15410060-4, Dis. PRIMER Ref. 1201, Pack Size: 1 PACK OF 348 ML (Q3) , HAL2309500430-63, Dis. ADHESIVE PRESSURE SENSITIVE, 9469-3M, 0.01" THICK, 6.0" WIDE. P/S: 1 ROLL OF 1 ROLL (Q3) , P/N. HAL2309500430-63, Dis. ADHESIVE PRESSURE SENSITIVE, 9469-3M, 0.01" THICK, 6.0" WIDE. P/S: 1ROLL OF 1 ROL (Q3) , P/N. 15160084-7, Dis. LUBRICANT MOLYKOTE AEROSOL 400ML, Pack Size: 1 PACK OF 0.3 KG (Q3) , P/N. 15160084-7, Dis. LUBRICANT MOLYKOTE AEROSOL 400ML. Pack Size: 1 PACK OF 0.3 KG (Q3) , P/N. 1176-0010-44, Dis. TEMPORARY SOLDER MASK, 8 OZ. BOTTLE-1030 Pack Size: 1 PACK OF 237 ML (Q3)
9991-10000 of 10000 archived Tenders