Tenders of Hindustan Aeronautics Limited
Tenders of Hindustan Aeronautics Limited
Hindustan Aeronautics Limited - HAL Tender
Electronics Equipment...+1Electrical and Electronics
GEM
India
Closing Date16 Mar 2024
Tender AmountRefer Documents
CATEGORY: Programmable regulated DC power supply (Q3) ,
Temperature Transducer with remote display (Q3) ,
Precision digital pressure indicator (Q3) , Precision digital
pressure indicator_ 0-100psi (Q3)
Hindustan Aeronautics Limited - HAL Tender
GEM
India
Closing Date16 Mar 2024
Tender AmountRefer Documents
CATEGORY: P/N. HAL2034140075-28, Dis. RTV 3140 CLEAR (DOW
CORNING) , Pack Size: 1 PACK OF 90 GMS (Q3) , P/N.
HAL2034140082-07, Dis. SILICON RUBBER SEALANT RTV
3145, CLEAR/GREY Pack Size: 1 PACK OF 90 GMS (Q3) , P/N.
191660651, Dis. P. THERMAL CONDUCTRICE OXIME RTV,
TCOR75SSERINGUE75ML, ELECTROLUBE. P/S: 1Pack
of90GMS (Q3) , P/N. 191660651, Dis. PASTE THERMAL
CONDUCTRICE OXIME RTV, TCOR75S SERINGUE75ML,
ELECTROLUBE. P/S: 1P. OF75ML (Q3) , P/N. 185001971, Dis.
SILICONE RTV INCOLORE EQ: 15120430-6, TSE-392-C TUBE
100G, 3M. P. Si: 1PACK OF100ML (Q3) , P/N. 185001971,
Dis. SILICONE RTV INCOLORE EQ: 15120430-6, TSE-392-C
TUBE 100G, 3M. Pac. Si: 1PACK OF100ML (Q3) , P/N. 1178-
0106-10, Dis. SILI, RUB. KIT, SILASTICJRTVKIT, 2PARTS-KIT*
BASE-COLO. BEI. , CUR. A-G, P. S1KITOF1100GMS (Q3) , P/N.
1178-0106-10, Dis. SILI. , RUB. KIT, SILASTIC JRTV KIT, 2P. -
KIT* BASE-COLOUR B. CU. A-G, P. S: 1KITOF1100GMS (Q3) ,
P/N. 1183-0101-00, Di. SI. AD. /S. , ELE72-
00002CON/RTVAG1PA. P. E. S: SD1183-0101-00TE. P/N:
CO/RT, PS: 1TU56.7GMS (Q3) , P/N. 1183-0101-00, D. S.
A/SE72-00002C/RAG1PPES: SD1183-0101-00T. P/N: C/R=
I72-00002RSAS1TUB56.7GMS (Q3) , P/N. 1183-0162-00, Di.
ADHESIVE, SILICONE ADHESIVE/SEALANT ELE72-
000035CON--/RTV NICKELP/S: 1KITOF454GMS (Q3) , 162-00.
SEALANT ELE 72-000035 CON-/RTV NICKEL. P/S. 1 KIT OF
454 GMS. or Chobond 1075, P/S: 2.5OZ / kit (Q3) , P/N.
HAL2032390040-08, Dis. ADHESIVE EPOXY, TRA-BOND-BB-
2112, Pack Size: 1 PACK OF 7.8 GMS (Q3) , P/N. CHO-BOND-
50-02-1030-0000, Dis. CHOBOND ADHESIVE1030, FOR O-
RING WITH PRIMER1086 P/S: 1KIT OF113.4ML (Q3) , P/N.
CHO-BOND-50-02-1030-0000, DisCHOBOND ADHESIVE1030,
FOR O-RING WITH PRIMER1086 P/S: 1KIT OF113.4ML (Q3) ,
P/N. 15122013-6, Dis. GLUE CYANOLITE TYPE 201, Pack Size:
1 PACK OF 2 GMS (Q3) , P/N. 15120258-4, Dis. GLUE
ECCOBOND 104 (A+ B) , EMERSON & CUMING OR HENKAL
Pack Size: 1 KIT OF 500 GMS (Q3) , P/N. 1754-631, Dis.
TENSOL CEMENT NO. 70, ICI. , Pack Size: 1 PACK OF 225 ML
(Q3) , P/N. 15120230-2, Dis. E-Solder 3021 Glue, A+ B
(SILVER-CONDUCTIVE-ADHESIVE) P/Siz: 1 KIT OF 2.2566 KG
(Q3) , P/N. 15120230-2, Dis. E-Solder 3021 Glue, A+ B
(SILVER-CONDUCTIVE-ADHESIVE) Pack Size: 1KIT
OF2.2566KG (Q3) , P/N. HAL2908090000-16, Dis. Solder
Paste, NCSMQ92H Pack Size: 1 PKT OF 500 GMS (Q3) , P/N.
HAL2908090015-68, Dis. SOLDER FLUX GEL NO CLEAN, Pack
Size: 1 PACK OF 10 GMS (Q3) , P/N. HAL2032040010-82, Dis.
ADHESIVE BOSTIK 1782, Pack Size: 1 PACK OF 1000 GMS
(Q3) , P/N. 01752-00297, Dis. PRIMER, SILCOSET 105 WITH
CURING AGENT A Pack Size: 1 KIT OF 1010 GMS (Q3) , P/N.
HAL2305810010-34, Dis. PRIMER FOR SILICON RUBBER,
CLEAR, DC Pack Size: 1 PACK OF 500 ML (Q3) , P/N.
15410060-4, Dis. PRIMER Ref. 1201, Pack Size: 1 PACK OF
348 ML (Q3) , HAL2309500430-63, Dis. ADHESIVE
PRESSURE SENSITIVE, 9469-3M, 0.01" THICK, 6.0" WIDE.
P/S: 1 ROLL OF 1 ROLL (Q3) , P/N. HAL2309500430-63, Dis.
ADHESIVE PRESSURE SENSITIVE, 9469-3M, 0.01" THICK,
6.0" WIDE. P/S: 1ROLL OF 1 ROL (Q3) , P/N. 15160084-7,
Dis. LUBRICANT MOLYKOTE AEROSOL 400ML, Pack Size: 1
PACK OF 0.3 KG (Q3) , P/N. 15160084-7, Dis. LUBRICANT
MOLYKOTE AEROSOL 400ML. Pack Size: 1 PACK OF 0.3 KG
(Q3) , P/N. 1176-0010-44, Dis. TEMPORARY SOLDER MASK, 8
OZ. BOTTLE-1030 Pack Size: 1 PACK OF 237 ML (Q3)
9991-10000 of 10000 archived Tenders