Tenders of University Of Strathclyde

Tenders of University Of Strathclyde

University Of Strathclyde Tender

Security and Emergency Services
United Kingdom
Closing Date30 May 2024
Tender AmountGBP 950 K (USD 1.2 Million)
Provision Of A Cctv Maintenance Measured Term Contract (mtc) (2024-28)

University Of Strathclyde Tender

Solid Waste Management
United Kingdom
Closing Date5 Jun 2024
Tender AmountRefer Documents 
Supply, Delivery And Commissioning Of A 5 Stage Mixed- Suspension, Mixed-product Removal (msmpr) System

University Of Strathclyde Tender

Electrical Goods and Equipments...+2Machinery and Tools, Electrical and Electronics
United Kingdom
Closing Date8 May 2024
Tender AmountRefer Documents 
Supply, Delivery And Installation Of Spray Dryer For Cmac

University Of Strathclyde Tender

Machinery and Tools
United Kingdom
Closing Date11 Jun 2024
Tender AmountRefer Documents 
Supply Delivery And Installation Of A High-performance Orbital Tig Welding System For In-process Ultrasonic Inspection

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Closing Date12 Jun 2024
Tender AmountRefer Documents 
Supply And Delivery Of A Low-latency Real-time 64:64 Paut Controller(s)

University Of Strathclyde Tender

Others
United Kingdom
Closing Date13 Jun 2024
Tender AmountGBP 300 K (USD 383.6 K)
Executive Search

University Of Strathclyde Tender

Others
United Kingdom
Closing Date13 Jun 2024
Tender AmountGBP 300 K (USD 383.6 K)
Executive Search

University Of Strathclyde Tender

Machinery and Tools
United Kingdom
Closing Date22 Jul 2024
Tender AmountGBP 1 Million (USD 1.2 Million)
Supply, Delivery And Installation Of Wafer Dicing Kit For Nmis

University Of Strathclyde Tender

Machinery and Tools
United Kingdom
Closing Date24 Jul 2024
Tender AmountGBP 66 K (USD 85.4 K)
Supply, Delivery And Installation Of A Wafer Mount For Nmis

University Of Strathclyde Tender

Electronics Equipment...+1Electrical and Electronics
United Kingdom
Closing Date23 Aug 2024
Tender AmountRefer Documents 
Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, And Encapsulation Equipment.
101-110 of 256 archived Tenders